In this paper we illustrate the use of a Genetic Algorithm (GA), available within a general optimisation system, in combination with a Finite Element package, for the direct design of shape in conduction heat transfer. The problems considered are relative to optimization of cylindrical fins, and to the direct design of shape for a heated substrate cooled by convection. The optimization of axisymmetric fins represents a simple problem, for which an analytical solution is available, and that has been also considered by other authors. The direct design of shape represents a typical problem in heat conduction, where the body shape is required that yields the desired distribution of both temperature and heat flux on its surface. For this problem, first the two-dimensional case is considered, and then a more complex three-dimensional problem is attempted. From the results obtained, it is concluded that our approach is accurate and robust, and can be applied todesign tasks of heat transfer systems and devices.
Direct design of shape in conduction problems,
PINTO, FRANCESCO;NOBILE, ENRICO;ZANDEGIACOMO DE ZORZI, EZIO
2003-01-01
Abstract
In this paper we illustrate the use of a Genetic Algorithm (GA), available within a general optimisation system, in combination with a Finite Element package, for the direct design of shape in conduction heat transfer. The problems considered are relative to optimization of cylindrical fins, and to the direct design of shape for a heated substrate cooled by convection. The optimization of axisymmetric fins represents a simple problem, for which an analytical solution is available, and that has been also considered by other authors. The direct design of shape represents a typical problem in heat conduction, where the body shape is required that yields the desired distribution of both temperature and heat flux on its surface. For this problem, first the two-dimensional case is considered, and then a more complex three-dimensional problem is attempted. From the results obtained, it is concluded that our approach is accurate and robust, and can be applied todesign tasks of heat transfer systems and devices.Pubblicazioni consigliate
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