Charge transfer processes between donor-acceptor complexes and metallic electrodes are at the heart of novel organic optoelectronic devices such as solar cells. Here, a combined approach of surface-sensitive microscopy, synchrotron radiation spectroscopy, and state-of-the-art ab initio calculations is used to demonstrate, the delicate balance that exists between intermolecular and molecule-substrate interactions, hybridization, and charge transfer in model donor-acceptor assemblies at metal-organic interfaces. It is shown that charge transfer and chemical properties of interfaces based on single component layers : can hot be naively extrapolated to binary donor-acceptor assemblies. In particular, studying the self-assembly of supramolecular nanostrurtures on Cu(111), composed of fluorinated copper-phthalocyanines (F(16)CuPc) and diindenoperylene (DIP), it is found that, in reference to the associated single component layers, the donor (DIP) decouples electronically from the metal surface, while the acceptor (F(16)CuPc) suffiers strong hybridization with the substrate.
Customized Electronic Coupling in Self-Assembled Donor-Acceptor Nanostructures (p NA)
MORGANTE, ALBERTO;
2009-01-01
Abstract
Charge transfer processes between donor-acceptor complexes and metallic electrodes are at the heart of novel organic optoelectronic devices such as solar cells. Here, a combined approach of surface-sensitive microscopy, synchrotron radiation spectroscopy, and state-of-the-art ab initio calculations is used to demonstrate, the delicate balance that exists between intermolecular and molecule-substrate interactions, hybridization, and charge transfer in model donor-acceptor assemblies at metal-organic interfaces. It is shown that charge transfer and chemical properties of interfaces based on single component layers : can hot be naively extrapolated to binary donor-acceptor assemblies. In particular, studying the self-assembly of supramolecular nanostrurtures on Cu(111), composed of fluorinated copper-phthalocyanines (F(16)CuPc) and diindenoperylene (DIP), it is found that, in reference to the associated single component layers, the donor (DIP) decouples electronically from the metal surface, while the acceptor (F(16)CuPc) suffiers strong hybridization with the substrate.Pubblicazioni consigliate
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