We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised ‘‘MAPS foil’’, is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
The MAPS foil
G. Contin;
2023-01-01
Abstract
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised ‘‘MAPS foil’’, is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.| File | Dimensione | Formato | |
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1-s2.0-S0168900222009652-main.pdf
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